MPi Advanced Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is broadly used on gold bump and pad wafer testing for Screen driver, logic, and memory machine. MPI’s cantilever probes are classified as the corresponding respond to towards the needs of fi­ne pitch, modest pad dimensions, superior velocity, much less cleaning, multi-DUT, higher pin count, and ultra-low leakage specifications. With exceptional craftsmanship, modern architecture and demonstrated methodologies dependant on mechanical and electrical simulation/measurement success, earning MPI the highest cantilever company all over the world.


FCB Probe Card

The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It is actually aimed to obtain the semiconductor ship manufacture time-to-sector (TTM) and value of examination (COT) need. FCB is actually a confirmed Answer for a number of semiconductor production tests from early engineering pilot-operates to high quantity production (HVM). FCB is ready for device demanding substantial signal integrity probing (SI) and/or energy integrity probing (PI). Purposes include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB guarantees the earth’s ideal General Price tag-of-possession (COO) for numerous DUT purposes.


EVS Probe Card

The EVS Probe Card is definitely an improvement above the conventional buckling beam probe card. Vital functions are bigger current carrying ability (C.C.C.) and reduce balanced Call power (BCF), as well as Total MEMS-like traits. EVS can certainly meet the prerequisite of advanced wafer probing. Exact alignment and excellent planarity Management are definitely the crucial things contributing to stable Get in touch with resistance. With its ability and overall performance, EVS Probe Card is an excellent option for Sophisticated probe cards.


Osprey probe card

The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It can be designed for smaller sized Al pad, which is perfect for very small pitch application with peripheral and total array pattern. With exact alignment and improved planarity control, Osprey can achieve increased efficiency by multi-DUT structure.  The forming wire (FW) type needle here created with MPI’s possess micro fabrication course of action don't just provides superior-top quality effectiveness but will also lets quick needle substitution and shortens protecting cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for the desire of lower power probing. In addition, it comes with the ability to fulfill superior C.C.C. and superior pin counts software. The MEMS approach guarantees very constant needle characteristics, as well as Exclusive framework style permits specific alignment and planarity Handle.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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